At the end of February, PICMG (PCI Industrial Computer Manufacturers Group)—the consortium for open hardware specifications—introduced InterEdge, a modular architecture for process control systems ...

Raj Batra, president of Siemens Digital Industries USA at the Automation Summit 2019 Digital disruption was the theme at the Siemens Automation Summit 2019, the annual user conference that drew over ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...